Copper and Nickel Plating
Coating / Plating
Plating Technology for High-Performance Engineering Plastics
OVC delivers specialized copper plating for high-performance engineering plastics. Engineered for lighter and durable electronics, our dry etching process ensures strong adhesion and a smooth finish, reducing transmission loss in high-frequency and millimeter-wave applications across polymer films and plates.
Key Applications
We are actively expanding this technology as a high-performance alternative across key components:
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Connectors & Antenna Parts: Lightweight, reliable interconnect solutions.
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Millimeter-Wave Radar Components: Built for low transmission loss in high-frequency radar systems.
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EMI Shielding: Dependable electromagnetic shielding for functional electronic housings and parts.
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Custom Coating Specifications: Adjustable plating thickness and electroless nickel plating available, supporting complete verification from prototype evaluation to mass production.
Plating Adhesion Test Results
Evaluated on various engineering plastic substrate resin plates using electrolytic Cu plating ($20\mu m$).
| Material | Grade | Size (mm) | Dry Etching | Electroless Cu | Electrolytic Cu | Peel Strength (N/cm) |
| SPS | SP151/S | $40 \times 80$ | ✓ | ✓ | ✓ | 5.72 / 6.04 |
| SPS | AS75W20B | $40 \times 80$ | ✓ | ✓ | ✓ | 3.36 / 3.16 |
| PPS (DG) | Glass Fiber Reinforced | $30 \times 60$ | ✓ | ✓ | ✓ | 6.40 / 3.18 |
| PPS (D) | Non-Reinforced | $30 \times 60$ | ✓ | ✓ | ✓ | 2.33 / 1.52 |
| PEEK | 450G | $35 \times 75$ | ✓ | ✓ | ✓ | 1.41 / 5.70 |
| LCP (C8) | C810 | $40 \times 80$ | ✓ | ✓ | ✓ | 0.97 / 0.76 |
| LCP (E13) | E130i | $40 \times 80$ | ✓ | ✓ | ✓ | 0.92 / 0.96 |
| PPE | AH60/9001 | $50 \times 100$ | ✓ | ✓ | ✓ | 5.50 / 8.43 |
| POM | F20-03 / E9001 | $25 \times 60$ | ✓ | ✓ | ✓ | NG |
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