We are pleased to announce that Osaka Vacuum Chemical (M) Sdn Bhd will be exhibiting at Manufacturing World Osaka 2026, to be held at INTEX Osaka from October 7 to
October 9, 2026.
At this exhibition, our main focus will be on our developing plating technologies for difficult-to-plate materials.
Rather than introducing our conventional surface treatment capabilities, we will showcase plating solutions for materials that are generally considered difficult to plate using conventional processes, including PPS, LCP, PEEK, COP, PTFE, glass, ceramics, and other advanced materials.
By applying plating to these challenging materials, we aim to add new functions and value, such as electrical conductivity, electromagnetic shielding, decorative appearance, and improved durability.
At our booth, visitors will be able to view our development technologies and sample products. We also look forward to discussing customers’ challenges related to materials and surface treatment, as well as exploring potential applications for new products.
For those facing challenges such as, “Can this material be plated?” or “Conventional surface treatments cannot meet our required performance,” we warmly invite you to visit our booth.
Event Details
* Event: Manufacturing World Osaka 2026
* Dates: October 7 (Wed) – October 9 (Fri), 2026
* Venue: INTEX Osaka, Japan
* Official Website: https://www.manufacturing-world.jp/osaka/ja-jp.html
Booth location and meeting arrangements will be announced closer to the event date.
We look forward to welcoming you to our booth.
